• Model NO.：hast-55
• Device Cooling Method：Natural Cooling or Air Purging Type
• Temp. Range：105c~135c(at 100% Relative Humidity)
• Humidity Range：Std Saturation Test Mode: 100%Rh
• Pressure Range：Gauge Pressure: +0.2 ~ 200kpa
• Standards Complied：IEC-60068-2-66
• Inside Material：SUS316 Stainless Steel Plate
• Transport Package：by Plywood Case
• Specification：Ø 550 mm*D650mm
• Trademark：KOMEG
• Origin：China
• HS Code：90321000
• Production Capacity：6000PCS,Year

Basic Info.

Model NO. hast-55 Device Cooling Method Natural Cooling or Air Purging Type Temp. Range 105c~135c(at 100% Relative Humidity) Humidity Range Std Saturation Test Mode: 100%Rh Pressure Range Gauge Pressure: +0.2 ~ 200kpa Standards Complied IEC-60068-2-66 Inside Material SUS316 Stainless Steel Plate Transport Package by Plywood Case Specification Ø 550 mm*D650mm Trademark KOMEG Origin China HS Code 90321000 Production Capacity 6000PCS/Year

Product Description

PCT High Pressure Accelerated Aging Test Mahcine for Semi Conductor Reliability Testing

Product description

The purpose of the Highly Accelerated Aging Test (HAST) is to increase product environmental stress (such as temperature) and working stress (voltage, load, etc. applied to the product), speed up the test process, and shorten the life test time of the product or system. , The reliability of semiconductor products has improved. At present, most electronic devices can withstand long-term high temperature and high humidity deviation tests without failure. Therefore, the test time used to determine the quality of the finished product has also increased a lot. In the design stage of the product, it is used to quickly expose the defects and weaknesses of the product, and test the sealing and aging performance of its products.

Volume and dimension

Volume	About 55L
Interior size	Ø550 mm*D650mm(Drum type pressure inner box)
Exterior size	W900 mm*H1552mm*D1500 mm(Excluding the protruding part of the machine!) Tips: For external dimensions, please confirm the three views according to the final design!

The main technical parameters

Test Conditions	Cool method: :Natural cooling or air purging Measured at a room temperature of +25 ºC under no load, Measured at normal pressure 101.3Kpa, the temperature and humidity performance test is measured according to the relevant regulations according to GB/T 2424.5 or IEC60068 -3; the sensor is placed at the air outlet of the air handling unit.
Temperature range	+105ºC~+135ºC(At 100% relative humidity)
Temp.  fluctuation	±0.5ºC
Temp. uniformity	≤±3.0ºC
Temp. deviation	≤±3.0ºC
Humidity range	1) HUM unsaturated test mode: 65~100%RH 2) STD saturation test mode: 100%RH
Humidity Fluctuation	±3.0%RH
Humidity Deviation	±5.0%RH
Temperature change rate	Heat up rate:  +25ºC~+135ºC, full range average speed  approx 45 min (no-load,no heating)
Load	no
	Note:Measured at a room temperature of +25 ºC under no load,the temperature and humidity performance test is measured according to the relevant regulations according to GB/T 2424.5 or IEC60068 -3; the sensor is placed at the air outlet of the air handling unit.
Pressure range	Gauge pressure: +0.2 ~ 200Kpa *Absolute pressure: 100 ~ 300Kpa
Pressure deviation	≤±2 kPa
Pressure rise time	Atmospheric pressure to 200Kpa   20min

Features:
The industry's first application of fluid simulation design technology and product process manufacturing technology, the product is more energy-efficient.
The inner tank adopts a double-layer arc design, which can prevent the phenomenon of condensation and dripping in the test, so as to avoid the direct impact of the superheated steam on the product in the test process and affect the test result.
Fully automatic water replenishment function, front-mounted water level confirmation.
(Attached table)

Test conditions	Temperature	Humidity	Duration	Remark
JEDE-22-A102	121ºC	100%R.H.	168h	Other duration: 24h, 48h, 96h, 168h, 240h, 336h
IPC-FC-241B-PCB tensile strength test of copper laminate	121ºC	100%R.H.	100h	Copper laminate strength: 1000N/m
IC auto clave testing	121ºC	100%R.H.	288h
Low dielectric high heat resistance multilayer board	121ºC	100%R.H.	192h
PCB plugging agent	121ºC	100%R.H.	192h
PCB-PCT test	121ºC	100%R.H.	30min	Lamination, bubble, white dot
Lead free soldering accelerated aging test 1	121ºC	100%R.H.	8h	Equivalent to 6 months high temp high humidity, activation energy: 4.44ev
Lead free soldering accelerated aging test 2	121ºC	100%R.H.	16h	Equivalent to 12 months high temp high humidity, activation energy: 4.44ev
IC lead free aging test	121ºC	100%R.H.	1000h	Check at every 500h
Flat panel tightness test	121ºC	100%R.H.	12h
Metallic gasket	121ºC	100%R.H.	24h
IC packaging test	121ºC	100%R.H.	500h, 1000h
PCB moisture absorb test	121ºC	100%R.H.	5h, 8h
FPC moisture absorb test	121ºC	100%R.H.	192h
PCB plugging agent	121ºC	100%R.H.	192h
Low dielectric high heat resistance multilayer material	121ºC	100%R.H.	5h	Water absorption less than 0.4-0.6%
High Tg glass epoxy multilayer PCB material	121ºC	100%R.H.	5h	Water absorption less than 0.55-0.65%
High Tg glass epoxy multilayer PCB material Heat resistance of reflow welding after moisture absorption	121ºC	100%R.H.	3h
Co-bra Bond	121ºC	100%R.H.	168h
Automotive PCB	121ºC	100%R.H.	50h, 100h
Mainboard PCB	121ºC	100%R.H.	30min
GBA board	121ºC	100%R.H.	24h
IC accelerated moisture resistance test	121ºC	100%R.H.	8h