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BGA162 0.5mm Emcp 11.5X13mm SD Test Socket with Solder Ball

Sireda Technology Co., Ltd.
  • IC Size：11.5X13mm
  • Pin：162
  • Structure：Clamshell
  • Package：BGA
  • Contact：Spring Probe
  • Transport Package：Carton Box

Base Info

  • Model NO.：702-0000857
  • Specification：eMCP BGA162 11.5x13mm
  • Trademark：Sireda
  • Origin：Shenzhen, China
  • HS Code：8536690000
  • Production Capacity：2000PCS,Month

Description

Material Socket BodyPPSMaterial Socket LidAL, POMContactPogo PinOperation Temperature0 ~ 80 ºCLife Span 30 K CyclesSpring Force:20g ~ 30g per Pin

ElectricalCurrent Rating1.5ADC Resistance<100mΩ@0.65mm


We provide a large range of customized sockets. If you have special requirement or want to learn more about us, please have a look at our website siredatech.en.made-in-china.com.